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N&K 5300 CD Trench Depth & Thin film thickness Measurement |
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NK5300 |
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N&K |
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12"
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Vintage |
2006-3 |
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Fully Automated Thin Film Metrology System for Patterned and Unpatterned Wafers
DUV - Vis - NIR: 190nm to 1000nm
Reflectance, Polarized Analyzer Unit with spot size : 50 um
Cognex Pattern Recognition Software
n&k's Thin Film Characterization S/W
n&k's Standard Films Library
Automated Wafer Loading/Unloading
Brooks Loadport for 12" Wafers
Computerized X-Y stage for full wafer mapping,and wafer alignment capability
Z-stage to acccommodate multiple substrate thickness
SEMI and CE Certification
Application :
Simultaneously determines thickness, n and k of thin films including semiconductors,dielectronics (SiO2, Si3N4),etc, Polymers (Photoresist,etc),and very thin metals
- Thin Film : Film Thickness / n and k
- OCD : Depth / CD / Profile
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