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Àåºñ¸í N&K 5300 CD Trench Depth & Thin film thickness Measurement
¸ðµ¨¸í NK5300 Á¦Á¶»ç N&K
¿þÀÌÆÛ»çÀÌÁî 12" Vintage 2006-3
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Á¦¿ø Fully Automated Thin Film Metrology System for Patterned and Unpatterned Wafers

DUV - Vis - NIR: 190nm to 1000nm
Reflectance, Polarized Analyzer Unit with spot size : 50 um
Cognex Pattern Recognition Software
n&k's Thin Film Characterization S/W
n&k's Standard Films Library
Automated Wafer Loading/Unloading
Brooks Loadport for 12" Wafers
Computerized X-Y stage for full wafer mapping,and wafer alignment capability
Z-stage to acccommodate multiple substrate thickness
SEMI and CE Certification
Application :
Simultaneously determines thickness, n and k of thin films including semiconductors,dielectronics (SiO2, Si3N4),etc, Polymers (Photoresist,etc),and very thin metals

- Thin Film : Film Thickness / n and k
- OCD : Depth / CD / Profile
     
  - Ãæû³²µµ õ¾È½Ã µ¿³²±¸ ÅëÁ¤3·Î 3 (ÁÖ)Á¦³×½Ã½º ¿ì)31208 TEL: 041-554-6920~1 FAX: 041-554-6922